Description
Key Features
| Physical Properties | |
|---|---|
| Thickness | 590µm (Excluding backing release film) |
| Abrasive Material | Aluminum oxide |
| Abrasive Size | 2.0µm |
| Heat-resistance | 120°C |
The unique feature of the NWE type is its denser polishing layer, achieved through smaller foam pores compared to the existing SWE type. This characteristic makes it particularly suitable for narrow pin pitch probe cards. As semiconductor devices continue to shrink in size, probe card pin pitches are also becoming narrower. The NWE type is designed specifically to address the needs of narrow pin pitch probe cards.
| Physical Properties | |
|---|---|
| Thickness | 590µm (Excluding backing release film) |
| Abrasive Material | Aluminum oxide |
| Abrasive Size | 2.0µm |
| Heat-resistance | 120°C |
For inquiries about our products and services,

CONTACT US
Inquiry
please contact us by below.