Polishing Process for PCB

• Deburring drilling hole before plating process
  • Deburr drilling hole and surface grind
• Removing roughness after plating process
  • Improve adhesion by removing roughness on the plating surface before putting the dry film
• Removing filling ink and flattening
  • Remove filling ink with high performance abrasive and flatten circuit board
• Removing dirt and flaw on intermediate SUS plate
  • Clean surface of SUS used for laminating multilayer plate

Advantages
· Effective for removing unevenness
· High endurance

Application
· Removing hole plugging ink
· Stainless steel plate polishing