Feature:
· Environmentally friendly non-chemical process.
· Flexible polishing process is possible by unique polishing mechanism.
· Shape can be highly controlled.
· High selectivity of polishing process.
· Polishing method by polishing system makes easy consumable control.
· Stable process capability.

Applicable Process:
SI Wafer Maker
· Edge Polishing Process (After Edge Grinder or Etching Process)
· Edge Grinding Process
· SOI Wafer Terrace or Wafer edge layer removal

Device Maker
· Wafer Edge or Top Edge layer removal (ex. GaN layer etc.)
· Wafer Edge trimming at Back Grind process or TSV process
· Thin wafer (after BG) edge reshape
· Bonded wafer edge reshape
· Size Down Wafer Edge Beveling

Reclaim Wafer Maker
· Edge polishing (removal layer and polishing)

Other substrate (SiC, GaN, Sapphire and GaAs etc.)
· Wafer Edge Beveling and polishing